Semiconductor Polishing Pads
AMG-5 POLISHING PAD
FOR USE ON: Silicon, Sapphire and Silicon Carbide DUROMETER: C Scale 55 +/- 5, D Scale 36 +/- 5 COMPRESSION %: 1.5-2.5% (1/2 lb. force displacement) DENSITY: .28-.32 g/cm3 THICKNESS: .050” / 1.27mm DIAMETER: Up To 60” Sheets or Pads DESCRIPTION: Fibrous...
EL1-KS POLISHING MATERIAL – New, More Durable, Premium Stock Removal Polishing Pad
FOR USE ON: Most Semiconductor, Compound Semi, Optic/Electro-Optic & Sapphire Applications DUROMETER (Scale C): 58 COMPRESSION %: 2% (1/2 lb. force displacement) DENSITY: .53 g/cm3 (25 lb.) THICKNESS: 0.050” DIAMETER: Up To 60” Sheets or Pads DESCRIPTION:...
Spartan Warrior Pad
FOR USE ON: The Spartan Warrior Pad is a versatile pad and can be used for most polishing applications by adjusting the polishing process variable parameter. HARDNESS (Scale C): 42 COMPRESSION %: 5% DENSITY: 0.326 g/cm3 THICKNESS: 0.050”-0.220” DIAMETER: Plain up to...
Spartan OMNI-White Polishing Pad
FOR USE ON: Optical, electro-optical, metals, semiconductor, compound semiconductor and ceramic materials as a gentle stock removal pad or a final polishing pad. HARDNESS (Scale C): 55 - 60 COMPRESSION %: 11-13% DENSITY: 0.383-0.468 g/cm3 THICKNESS: 0.050”, 0.090”,...
Spar-Lon 2
FOR USE ON: This final polishing pad can be used on sapphire, glass, plastics, ceramics, and metals with a variety of abrasive slurries. DUROMETER: 80º Shore A COMPRESSION %: 4% (2 pound Displacement) DENSITY: .0.40 g/cm3 THICKNESS: .050” +/- .001” DIAMETER: Up to 58”...
Spartan Omni-Gray Polishing Pad
FOR USE ON: Silicon, Sapphire and Silicon Carbide for the 1st step polishing application SURFACE OPTIONS: Plain, grooved, or embossed (up to 36”) COMPRESSION %: 10% DENSITY: 0.300 g/cm³ THICKNESS: 0.050”, 0.090”, 0.125” DIAMETER: up to 60” DESCRIPTION: Spartan...
AMS Polishing Pad
FOR USE ON: Silicon Wafers, Cadmium Telluride, Gallium Arsenide, Stainless Steel, Sapphire, Silicon Carbide DUROMETER: Shore C Scale 60 COMPRESSION %: 4-6% (1/2 pound force displacement) DENSITY: .42 g/cm3 THICKNESS: .050", .090" and .125" DIAMETER: Up to 60" in...
Poretex 2LN Polishing Pads
FOR USE ON: Used to produce ultra polished surfaces with synthetic padsNAP LENGTH: » 50 μWEIGHT: 570 +/50 grams/linear yd.COMPRESSION %: 4.5 +/2.0%DENSITY: 0.42 +/0.05 g/cm3THICKNESS: 450 +/80μ mmDIAMETER: Precut or 53” wide rolls DESCRIPTION: In the surface...
Spartan Durotex
FOR USE ON: designed and manufactured to polish a wide variety of materials in a single-step type process including optics, electro-optics, semiconductor, aluminum discs, LCD/plasma display and ceramic compositions THICKNESS: 0.5 – 2.5mm DENSITY: 0.67 g/cm3 WIDTH: 400...
HPC75 Polishing Pad
FOR USE ON: Crystal and Medium Hardness Glass, Quartz, Stainless Steel DUROMETER: Shore C Scale 50 COMPRESSION %: 3-5% (1/2 pound force displacement) DENSITY: .33 g/cm3 THICKNESS: .050” DIAMETER: Up to 60” Sheets or Pads DESCRIPTION: White or color fiber based...
HPC5080 Polishing Pad
FOR USE ON: Hard Glass and Crystal DUROMETER: Shore C Scale 85 COMPRESSION %: 1-3% (1/2 pound force displacement) DENSITY: .85 g/cm3 THICKNESS: .045” DIAMETER: Up to 60” in Sheets or Pads DESCRIPTION: Yellow color, fiber based resin treated polyurethane pad for...
HPC4545 Polishing Pad
FOR USE ON: Silicon Wafers, Cadmium Telluride, Gallium Arsenide, Stainless Steel DUROMETER: Shore C Scale 55 COMPRESSION%: 3-5% (1/2 pound force displacement) DENSITY: .46 g/cm3 THICKNESS: .050” and .150” DIAMETER: Up to 60” in Sheets or Pads DESCRIPTION: White fiber...
