FOR USE ON: Optical, electro-optical, metals, semiconductor, compound semiconductor and ceramic materials as a gentle stock removal pad or a final polishing pad. HARDNESS (Scale C): 55 – 60 COMPRESSION %: 11-13% DENSITY: 0.383-0.468 g/cm3 THICKNESS: 0.050”,...
FOR USE ON: Hand Held Machines/Low to medium pressure applications DUROMETER: Shore C Scale 40 COMPRESSION %: 2-4% (4 pound force displacement) DENSITY: .37 g/cm3 THICKNESS: .090” and .150” DIAMETER: Up to 60” Sheets or Pads DESCRIPTION: White fiber based resin...
DESCRIPTION: Woven artificial silk pad for metallographic polishing using diamond slurries under 10 microns. Can be used with water or oil based slurries.
DESCRIPTION: A “final polishing pad” (flocked) to be used with diamond slurries or pastes 3 microns or under. HARDNESS: 40 Shore A THICKNESS: 1mm FIBER HEIGHT : 0.75mm
FOR USE ON: This final polishing pad can be used on sapphire, glass, plastics, ceramics, and metals with a variety of abrasive slurries.DUROMETER: 80º Shore ACOMPRESSION %: 4% (2 pound Displacement)DENSITY: .0.40 g/cm3THICKNESS: .050” +/- .001”DIAMETER: Up to 58” Pads...
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