Compound Semiconductor Polishing Pads

Series 5200 Polishing Pad

FOR USE ON: Silicon Carbide DUROMETER: C Scale 60 +/- 5 points COMPRESSION %: 4% (1/2 lb. force displacement) DENSITY: 0.36 g/cm3 THICKNESS: .050” / 1.27mm DIAMETER: Up To 60” Sheets or Pads DESCRIPTION: Fibrous non-woven material with excellent surface wear...

HPB-101CC POLISHING PAD

FOR USE ON: Glass (All types), sapphire, silicon/semiconductor materials, silicon carbide, Ceramics, optics, plastics and some metals. DUROMETER: C Scale 40 +/- 5 points COMPRESSION %: 2-4% (4 lb. force displacement) DENSITY: 0.48 g/cm3 THICKNESS: .150” / 3.81mm...

EL1-KS POLISHING MATERIAL – New, More Durable, Premium Stock Removal Polishing Pad

FOR USE ON: Most Semiconductor, Compound Semi, Optic/Electro-Optic & Sapphire Applications DUROMETER (Scale C): 58 COMPRESSION %: 2% (1/2 lb. force displacement) DENSITY: .53 g/cm3 (25 lb.) THICKNESS: 0.050” DIAMETER: Up To 60” Sheets or Pads DESCRIPTION:...

Spartan OMNI-White Polishing Pad

Spartan OMNI-White is a cross-functional polishing pad built to handle both stock removal and final surface generation in a single product — a fibrous, non-woven material with a textured gray surface and micro voids engineered for improved slurry distribution. Used as...

Spar-Lon 2

FOR USE ON: glass, semiconductors, compound semiconductors and infra-red materials DUROMETER: C Scale 60 COMPRESSION %: 2% (1/2 lb. force displacement) DENSITY: .485 g/cm3 THICKNESS: 0.050” DIAMETER: Up to 60” Sheets or Pads DESCRIPTION: Spartan Spar-Lon2; Tan...

HPC5080 Polishing Pad

FOR USE ON: Hard Glass and Crystal DUROMETER: Shore C Scale 85 COMPRESSION %: 1-3% (1/2 pound force displacement) DENSITY: .85 g/cm3 THICKNESS: .045” DIAMETER: Up to 60” in Sheets or Pads DESCRIPTION: Yellow color, fiber based resin treated polyurethane pad for...