FOR USE ON: Most Semiconductor, Compound Semi, Optic/Electro-Optic & Sapphire Applications DUROMETER (Scale C): 58 COMPRESSION %: 2% (1/2 lb. force displacement) DENSITY: .53 g/cm3 (25 lb.) THICKNESS: 0.050” DIAMETER: Up To 60” Sheets or Pads DESCRIPTION:...
FOR USE ON: Optical, electro-optical, metals, semiconductor, compound semiconductor and ceramic materials as a gentle stock removal pad or a final polishing pad. HARDNESS (Scale C): 55 – 60 COMPRESSION %: 11-13% DENSITY: 0.383-0.468 g/cm3 THICKNESS: 0.050”,...
FOR USE ON: This final polishing pad can be used on sapphire, glass, plastics, ceramics, and metals with a variety of abrasive slurries. DUROMETER: 80º Shore A COMPRESSION %: 4% (2 pound Displacement) DENSITY: .0.40 g/cm3 THICKNESS: .050” +/- .001” DIAMETER: Up to 58”...
FOR USE ON: Hard Glass and Crystal DUROMETER: Shore C Scale 85 COMPRESSION %: 1-3% (1/2 pound force displacement) DENSITY: .85 g/cm3 THICKNESS: .045” DIAMETER: Up to 60” in Sheets or Pads DESCRIPTION: Yellow color, fiber based resin treated polyurethane pad for...
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