FOR USE ON: semiconductor, compound semiconductor, sapphire, silicon
carbide, ceramic and other advanced materials
HARDNESS (Scale C): 65 +/- 3
COMPRESSIBILITY (%): 3.9 +/- 0.8
COMPRESSIVE ELASTIC MODULUS, (%): 70 +/- 10
Weight: 522 +/- 50 grams/square meter
THICKNESS: 0.025 +/- .001”
THICKNESS OF NAP LAYER: 500 +/- 80 µ
OPEN PORE SIZE: 80 +/- 20 µ
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DESCRIPTION:
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All pads are available with our own specially developed
PSA, magnetic or loop backing to be used with various hook attachments. We currently have 2 types of PSA that cover 2 specific markets. Our standard for the glass industry is one that resists temperatures up to 120°F, peels easily from the plate and can actually be reapplied. Our second type of PSA is a 3M product that is temperature resistant up to 160°F, resistant of pH changes from 5 to 10, but may leave some adhesive on the plate (depending on how it is run and removed). |
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BACKING:
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Plain, PSA or Backer Pad
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SURFACE OPTIONS:
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Perforated up to 55.5” or Embossed up to 36”
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