Poretex-UT polishing pads deliver high-hardness performance. These pads are in the same class as Poretex 2LN and 3LN, engineered for final-stage polishing of semiconductor, compound semiconductor, sapphire, silicon carbide, and other advanced materials. The difference comes down to backing and surface configuration: Poretex-UT is available with Spartan’s specially developed PSA, magnetic, or loop backing, plus a choice of perforated or embossed surface options — giving fabricators more flexibility to match existing tooling setups. If you’re unsure whether 3LN or UT is the better fit for your process, our team can help you decide based on your equipment and material specs.
Applications
- Semiconductor wafer final polishing
- Compound semiconductor and sapphire finishing
- Silicon carbide surface preparation
- Ceramic and advanced-material polishing
FOR USE ON: semiconductor, compound semiconductor, sapphire, silicon
carbide, ceramic and other advanced materials
HARDNESS (Scale C): 65 +/- 3
COMPRESSIBILITY (%): 3.9 +/- 0.8
COMPRESSIVE ELASTIC MODULUS, (%): 70 +/- 10
Weight: 522 +/- 50 grams/square meter
THICKNESS: 0.025 +/- .001”
THICKNESS OF NAP LAYER: 500 +/- 80 µ
OPEN PORE SIZE: 80 +/- 20 µ
|
DESCRIPTION:
|
All pads are available with our own specially developed
PSA, magnetic or loop backing to be used with various hook attachments. We currently have 2 types of PSA that cover 2 specific markets. Our standard for the glass industry is one that resists temperatures up to 120°F, peels easily from the plate and can actually be reapplied. Our second type of PSA is a 3M product that is temperature resistant up to 160°F, resistant of pH changes from 5 to 10, but may leave some adhesive on the plate (depending on how it is run and removed). |
|
BACKING:
|
Plain, PSA or Backer Pad
|
|
SURFACE OPTIONS:
|
Perforated up to 55.5” or Embossed up to 36”
|
