FOR USE ON: semiconductor, compound semiconductor, sapphire, silicon
carbide, ceramic and other advanced materials
HARDNESS (Scale C): 65 +/- 3
COMPRESSIBILITY (%): 3.9 +/- 0.8
COMPRESSIVE ELASTIC MODULUS, (%): 70 +/- 10
Weight: 522 +/- 50 grams/square meter
THICKNESS: 0.025 +/- .001”
THICKNESS OF NAP LAYER: 500 +/- 80 µ
OPEN PORE SIZE: 80 +/- 20 µ

 

DESCRIPTION:
All pads are available with our own specially developed
PSA, magnetic or loop backing to be used with various
hook attachments. We currently have 2 types of PSA that
cover 2 specific markets. Our standard for the glass
industry is one that resists temperatures up to 120°F, peels
easily from the plate and can actually be reapplied. Our
second type of PSA is a 3M product that is temperature
resistant up to 160°F, resistant of pH changes from 5 to 10,
but may leave some adhesive on the plate (depending on
how it is run and removed).
BACKING:
Plain, PSA or Backer Pad
SURFACE OPTIONS:
Perforated up to 55.5” or Embossed up to 36”