Poretex 3LN polishing pads are engineered for final-stage polishing of semiconductor, compound semiconductor, sapphire, silicon carbide, and other advanced materials where surface finish tolerances are tightest. Manufactured to consistent, tested specifications, Poretex 3LN pads are built for fabricators who can’t afford variability between production runs.
Applications
- Semiconductor wafer final polishing
- Compound semiconductor and sapphire finishing
- Silicon carbide surface preparation
- Ceramic and other advanced-material polishing
FOR USE ON: semiconductor, compound semiconductor, sapphire, silicon
carbide, ceramic and other advanced materials
HARDNESS (Scale C): 65 +/- 3
COMPRESSIBILITY (%): 3.9 +/- 0.8
COMPRESSIVE ELASTIC MODULUS, (%): 70 +/- 10
Weight: 522 +/- 50 grams/square meter
THICKNESS: 1.37 +/- 0.10 mm
THICKNESS OF NAP LAYER: 500 +/- 80 µ
OPEN PORE SIZE: 80 +/- 20 µ
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DESCRIPTION:
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All pads are available with our own specially developed
PSA, magnetic or loop backing to be used with various hook attachments. We currently have 2 types of PSA that cover 2 specific markets. Our standard for the glass industry is one that resists temperatures up to 120°F, peels easily from the plate and can actually be reapplied. Our second type of PSA is a 3M product that is temperature resistant up to 160°F, resistant of pH changes from 5 to 10, but may leave some adhesive on the plate (depending on how it is run and removed). |
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