Poretex 2LN is the main workhorse of our final polishing pads. It is a synthetic polishing pad designed specifically for producing ultra-polished surfaces, using a nap-length construction rather than a solid pad geometry. That makes it the right choice when your process runs on rolls or precut sheets instead of mounted, durometer-rated pads — it’s supplied as precut sheets or in 53″ wide rolls to fit continuous or high-volume finishing lines. If your equipment is built around roll-fed or sheet-fed polishing rather than individual mounted pads, Poretex 2LN is the pad in Spartan’s final-polishing line engineered for that format.
Applications
- Semiconductor and compound semiconductor wafer polishing
- Quartz, sapphire, and silicon carbide finishing
- Crystal polishing
- Roll-fed and precut sheet finishing lines
FOR USE ON: Used to produce ultra polished surfaces with synthetic pads
NAP LENGTH: » 50 μ
WEIGHT: 570 +/50 grams/linear yd.
COMPRESSION %: 4.5 +/2.0%
DENSITY: 0.42 +/0.05 g/cm3
THICKNESS: 450 +/80μ mm
DIAMETER: Precut up to 53” wide
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DESCRIPTION:
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In the surface preparation process, there is a need to produce ultra polished surfaces with synthetic pads. Spartan’s suede polishing material is designed to generate final polished surfaces using submicron slurries. It’s “low nap/small pore” composition retains the polishing vehicle on the exposed pad surface allowing for better polished surface quality and lower surface tension to the wafers being polished. Poretex 2LN™ is excellent for semiconductor and compound semiconductor wafers, quartz, sapphire, silicon carbide and various crystals. These pads are designed to work best with colloidal silica, sodium hydroxide, cerium and alumina slurries over a wide range of pH and slurry concentration mixtures.
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HARDNESS:
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64 +/5 SHORE C
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PORE SIZE:
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60 +/20μ
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