FOR USE ON: Silicon Wafers, Cadmium Telluride, Gallium Arsenide, Stainless Steel
DUROMETER: Shore C Scale 55
COMPRESSION%: 3-5% (1/2 pound force displacement)
DENSITY: .46 g/cm3
THICKNESS: .050” and .150”
DIAMETER: Up to 60” in Sheets or Pads

DESCRIPTION:
White fiber based resin treated polyurethane pad for diverse polishing applications and surfaces. The fiber material makes excellent interconnecting cellular structures, which make the pad highly durable and dimensionally stable. This material is designed for rapid stock removal and superb surface finishes.
FOR USE ON:
Silicon Wafers, Cadmium Telluride, Gallium Arsenide, Stainless Steel
DUROMETER:
Shore C Scale 55
COMPRESSION %:
3-5% (1/2 pound force displacement)
DENSITY:
.46 g/cm3
THICKNESS:

.050” and .150”

DIAMETER:
Up to 53” in Sheets or Pads
SURFACE PREPARATION:
Plain, Perforated or Embossed.
BACKINGS:
Easy Apply/Remove PSA Is Standard. High Temperature PSA Magnetic Backing are Available Upon Request
IMPREGNATIONS:
Abrasive Impregnates in limited styles.
CAN REPLACE:
SUBA X and SUBA 500
PERFORMANCE:
HPC4545 is our most popular hard class pad. It is a superbly durable synthetic fiber pad, effective under light pressure. Capillary action fiber structure. Open pore structure, reduced compressibility.