Final Polishing Pads
Comparing Spartan’s Final Polishing Pads
Spartan Felt offers four final-stage polishing pads, each tuned for a different balance of hardness, compressibility, and material compatibility. Here’s how to choose between them.
| Pad | Best For | Hardness (Scale C) | Compression | Key Trait |
|---|---|---|---|---|
| Poretex 3LN™ | Semiconductor, compound semiconductor, sapphire, silicon carbide, ceramics | 65 ± 3 | 3.9% ± 0.8 | Softer and more compressible due to higher pore height — works as a gentle final polish pad |
| Poretex-UT™ | Semiconductor, compound semiconductor, sapphire, silicon carbide, ceramics | 65 ± 3 | 3.9% ± 0.8 | Firmest of the four — built for advanced materials needing tight flatness control |
| OMNI-White | Optical, electro-optical, metals, semiconductor, compound semiconductor, ceramics | 55–60 | 11–13% | Softer and more compressible — works as either a gentle stock-removal pad or a final polish |
| Poretex 2LN | General ultra-polished surface finishing across multiple materials | N/A (nap-based, not durometer-rated) | 4.5% ± 2.0 | Napped poromeric construction rather than a solid pad. Available in sheet or pad offering. |
How to decide:
- If you’re polishing hard, brittle materials (sapphire, silicon carbide, compound semiconductors) start with Poretex 2LN or 3LN. If you want low-compression to resist rounded edges or over-polishing delicate wafer surfaces, use the Poretex UT.
- If you need a gentler, more forgiving pad — for optics, electro-optics, or metals where you’re removing stock before a final pass, or where the substrate is more forgiving of pressure — OMNI-White’s higher compression (11–13%) gives more cushioning and conformability.
- If your process runs on rolls or precut sheets rather than mounted pads, Poretex 2LN’s nap-length, weight-based construction (570 g/linear yd.) is built for that format rather than a rigid pad geometry.
- Poretex 3LN vs. Poretex-UT specifically: both share nearly identical hardness and compression specs, so the choice usually comes down to your existing tooling setup and polishing equipment compatibility — contact us with your current process parameters and we’ll confirm which is the better match, or recommend a custom variant.
Still not sure which pad fits your application? Contact our team with your material, target finish, and current process specs — we’ll help you match the right pad or engineer a custom solution.
Poretex 3LN™ Polishing Pads
Poretex 3LN polishing pads are engineered for final-stage polishing of semiconductor, compound semiconductor, sapphire, silicon carbide, and other advanced materials where surface finish tolerances are tightest. Manufactured to consistent, tested specifications,...
Poretex-UT™ Polishing Pads
Poretex-UT polishing pads deliver high-hardness performance. These pads are in the same class as Poretex 2LN and 3LN, engineered for final-stage polishing of semiconductor, compound semiconductor, sapphire, silicon carbide, and other advanced materials. The difference...
Spartan OMNI-White Polishing Pad
Spartan OMNI-White is a cross-functional polishing pad built to handle both stock removal and final surface generation in a single product — a fibrous, non-woven material with a textured gray surface and micro voids engineered for improved slurry distribution. Used as...
Poretex 2LN Polishing Pads
Poretex 2LN is the main workhorse of our final polishing pads. It is a synthetic polishing pad designed specifically for producing ultra-polished surfaces, using a nap-length construction rather than a solid pad geometry. That makes it the right choice when your...
