Compound Semiconductor Polishing Pads
Poretex 3LN™ Polishing Pads
FOR USE ON: semiconductor, compound semiconductor, sapphire, silicon carbide, ceramic and other advanced materials HARDNESS (Scale C): 65 +/- 3 COMPRESSIBILITY (%): 3.9 +/- 0.8 COMPRESSIVE ELASTIC MODULUS, (%): 70 +/- 10 Weight: 522 +/- 50 grams/square meter...
Poretex-UT™ Polishing Pads
FOR USE ON: semiconductor, compound semiconductor, sapphire, silicon carbide, ceramic and other advanced materials HARDNESS (Scale C): 65 +/- 3 COMPRESSIBILITY (%): 3.9 +/- 0.8 COMPRESSIVE ELASTIC MODULUS, (%): 70 +/- 10 Weight: 522 +/- 50 grams/square meter...
Spartan OMNI-White Polishing Pad
FOR USE ON: Optical, electro-optical, metals, semiconductor, compound semiconductor and ceramic materials as a gentle stock removal pad or a final polishing pad. HARDNESS (Scale C): 55 - 60 COMPRESSION %: 11-13% DENSITY: 0.383-0.468 g/cm3 THICKNESS: 0.050”, 0.090”,...
Poretex 2LN Polishing Pads
FOR USE ON: Used to produce ultra polished surfaces with synthetic padsNAP LENGTH: » 50 μWEIGHT: 570 +/50 grams/linear yd.COMPRESSION %: 4.5 +/2.0%DENSITY: 0.42 +/0.05 g/cm3THICKNESS: 450 +/80μ mmDIAMETER: Precut or 53” wide rolls DESCRIPTION: In the surface...
